• Berkshire Innovation Center

    Cutting-Edge Technology & Equipment

    Expand your innovation capacity and elevate your company's level of precision and analytical power with access to BIC's world-class cutting-edge advanced equipment.

Cutting-Edge Technology & Equipment

Expand your innovation capacity and elevate your company's level of precision and analytical power with access to BIC's world-class cutting-edge advanced equipment.

Advanced Equipment

Coordinate Measurement Machine "The Beast"

Hexagon Metrology CMM Model 121510
Measuring Range: 47" x 59" x 39"; PC DEMIS software to import/export CAD; Attachments: CMM-Ve Vision Probing System; CMS 108 Laser Scanner (reserve separately); Romer Absolute Arm 7525SE (reserve separately); InnovMetric Polyworks reverse engineering software (reserve separately); 

Laser Scanner (for CMM or Romer Arm)

Hexagon Metrology Laser Scanner CMS 108
Laser Sensor System with TKJ connection; High accuracy, non-contact sensor; Three zoom levels offering 25, 60, or 120 mm laser line; Connects to Tesastar-sm motorized probe on 121510 CMM machine or to Romer Absolute Arm portable CMM 7525SE

Romer Arm Portable CMM

Romer Absolute Arm 7525SE
Precision motion arm for portable CMM and laser scanning; Attachments: Touch probes from 121510 CMM; Laser Scanner CMS 108 (reserve serately); InnovMetric Polyworks reverse engineering software (reserve separately);

InnovMetric Reverse Engineering Software

InnovMetric Polyworks
Modeler Plus NURBS Module V12; Standard reverse engineering software package; Universal 3D platform can be used with Hexagon Metrology 121510 CMM or Romer Absolute Arm 7525SE; Dell Computer Workstation - Complete package per the system requirements of Solidworks including 24" monitor; Certified Solidworks Solution Partner

Solidworks CAD Software and Computer Workstation

Solidworks 2016 Seat with MasterCAM and Moldflow; Dell Computer Workstation - Complete package per the system requirements of Solidworks including 24" monitor;

Stratasys J750 3D Printer

Polyjet technology
Highest Resolution; Smooth Finish; Highest Speed; Can print 2 materials to replicate overmolding; Build envelope 20" x 16" x 8"; Layer thickness: 30 microns (.001") or 14 microns (.00055") micron layer thickness; Photopolymers: Digital ABS, Vero, Clear, Hi-Temp, Durus, Tango (like rubber), MED610; Support removal station;

Stratasys 450mc 3D Printer

Fused Deposition Modeling (FDM) technology; Largest Build Envelope: 16" x 14" x 16"; Highest durability for production or functional testing; Highest speed; Highest accuracy;  Layer thickness: .33 mm (0.013") or .13 mm (0.005"); Materials: ABS, PC, FDM Nylon 12, ULTEM (see data sheet for MORE); Support removal station

Stratasys Dimension 1200

Fused Deposition Modeling (FDM) technology; High Speed; Quality prototyping in ABS; Build envelope: 10" x 10" x 12"; Layer thickness: .007" or .010";  Cost effective for small parts or small number of parts; Support removal station;

 

EOS M290 Metal 3D Printer

Direct Metal Laser Sintering (DMLS) technology;  Build envelope 9.8" x 9.8" x 12.8";  Materials: Titanium, Stainless Steel, Cobalt/Chrome Alloys, Nickel Alloys;  Prototyping and additive manufacturing of metal products, parts, tools, and molds

Zeiss Axio Imager M2m Microscope Package

High powered digital imaging and surface analysis ideal for research and testing for materials and life sciences;  Elevates imaging capabilities up to lower levels of SEM;  Computer, Monitor, Touchscreen Controls, Camera, & Software; Fluorescence illumination package; Motorized Stage; Joystick 

Brookhaven Instruments Zeta Potential Analyzer

Measures and analyzes the electrostatic charge of particles; Rapid and accurate particle size distributions; ISO 13321 and ISO 22412 compliant results; Range > 0.3 nm to 6 µm; Ideal for fast, routine sizing applications in research or QC; For proteins, peptides, mAb, RNA, biological samples. organic solvents, oily or viscous media;